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lga package pressure module

The MEMS chip is prepared by the self-developed SENSA process and equipped with a special integrated circuit conditioning chip, which has the advantages of high accuracy, good stability, and excellent temperature compensation, etc. It can be packaged into the required pressure sensor form according to the customer's needs to achieve a specific proportional output signal calibration. The accuracy of this series of products is less than ± 2.0% in the compensation temperature range (-40°C to 125°C) and over the full range. The differential pressure module is a highly stable micro differential pressure chip module in LGA package based on ceramic material, which is prepared by the advanced world-wide all-silicon pressure sensor process and equipped with a special integrated circuit conditioning chip, which has the advantages of high accuracy, good stability and excellent temperature compensation. Calibration of the signal. The accuracy of this series is less than ± 3.0% in the compensation temperature range (-40°C to 125°C) and over the full range.
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Parameters

Technical parameters:

Specification Model Package form Size (mm) Pressure Type Pressure range Output Type Full scale output Operating temperature Temperature compensation Comprehensive accuracy
LSPMC04-01CXXX LGA 4.72*3.76 Absolute pressure 0~100KPa(Customizable) Analog Output 0.5~4.5V(Customizable) -40℃~125℃ Yes ±2%
LSPMC06-01CXXX LGA 4.72*3.76 Absolute pressure 0~300KPa(Customizable) Analog Output 0.5~4.5V(Customizable) -40℃~125℃ Yes ±2%
LSPMC07-01CXXX LGA 4.72*3.76 Absolute pressure 0~700KPa(Customizable) Analog Output 0.5~4.5V(Customizable) -40℃~125℃ Yes ±2%
LSPMC03-03CXXX LGA 4.72*3.76 Differential pressure/gauge pressure 0~25KPa(Customizable) Analog Output 0.5~4.5V(Customizable) -40℃~125℃ Yes ±2%
LSPMC04-05CXXX LGA 4.72*3.76 Differential pressure/gauge pressure 0~100KPa(Customizable) Analog Output 0.5~4.5V(Customizable) -40℃~125℃ Yes ±2%
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