Integrated conditioning and encapsulation pressure sensor
1. Wafers are designed and produced using our company's US patented SENSA process technology; 2. Proportional voltage output (0~5V), with temperature compensation and signal conditioning; 3. Wide temperature compensation range: -20℃ to +85℃; 4. High precision, superior performance, good stability, and high reliability; 5. Measurement range coverage: 5KPa/10KPa/40KPa/100KPa; 6. Reuse our company's silicon microphone industry chain, complete domestic industrial chain, high cost performance.
Category:
MEMS pressure sensor
Lingke Sensing
Product Description
Technical Parameters:
| Specifications | Packaging Type | Dimensions (mm) | Pressure Type | Pressure Range | Output Type | Full-Scale Output | Operating Temperature | Overall Accuracy |
| MSPC01-GAD-F | DIP-Forward | 8.5*8.5 | Gauge Pressure | 0~5KPa..10KPa | Analog Output | 0.5~4.5V | -40℃~85℃ | ±5% |
| MSPC01-GAD-R | DIP-Reverse | 8.5*8.5 | Gauge Pressure | 0~5KPa..10KPa | Analog Output | 0.5~4.5V | -40℃~85℃ | ±5% |
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