Electronic sphygmomanometer pressure sensor
1. Wafers are designed and produced using our company's US patented SENSA process technology.
2. The wafers have high consistency and are graded according to offset and span, with a total of 6 grades.
3. The temperature characteristics are highly concentrated, with a variation of less than 2 mmHg in the full temperature range of 5 to 45 degrees.
4. Non-linearity, pressure hysteresis, and temperature hysteresis are all within 3‰.
5. Reusing our company's silicon microphone industry chain, the entire industry chain is localized, and the cost performance is high.
Category:
MEMS pressure sensor
Lingke Sensing
Product Description
Technical Parameters:
| Specifications | Packaging Type | Dimensions (mm) | Pressure Type | Pressure Range | Output Type | Full-Scale Output | Linearity | Temperature Compensation | Operating Temperature |
| MSP40-GDF* | DIP-Forward | 8.5*8.5 | Gauge Pressure | 0~300mmHg | Bridge Output | 75mV | ±0.3% | Yes | -40℃~85℃ |
| MSP40-GDR* | DIP-Reverse | 8.5*8.5 | Gauge Pressure | 0~300mmHg | Bridge Output | 75mV | ±0.3% | Yes | -40℃~85℃ |
| MSP40-GSF* | SMD | 7*7 | Gauge Pressure | 0~300mmHg | Bridge Output | 75mV | ±0.3% | Yes | -40℃~85℃ |
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